AI and 6G systems are pushing the limits of performance, power, and integration, positioning glass substrates as a critical enabler of next-generation advanced packaging. With global semiconductor leaders expanding their U.S.-based manufacturing footprints, the need for coordinated domestic capability in advanced packaging is becoming increasingly urgent. This event convenes leaders across the ecosystem to align technology, validation, and adoption pathways—accelerating the use of glass substrates and strengthening U.S. leadership.
